- PII
- S0023476124040126-1
- DOI
- 10.31857/S0023476124040126
- Publication type
- Article
- Status
- Published
- Authors
- Volume/ Edition
- Volume 69 / Issue number 4
- Pages
- 661-669
- Abstract
- The possibility of forming a conductive metal-polymer composite based on an array of intersecting silver-containing nanowires has been demonstrated. It has been determined that the electrical and mechanical characteristics of the composites depend both on the deposition time and on the ratio of the anode to cathode areas. The resulting metal-polymer composites had mechanical characteristics exceeding those of polymer track membranes made of polyethylene terephthalate. At the same time, with an increase in the ratio of anode to cathode areas and an increase in deposition time, the samples exhibit a decrease in the values of electrical conductivity (0.0025 Ω-1 – at 100 growth cycles, 0.0033 Ω-1 – at 50 cycles), strength (90 MPa – at 100 cycles, 99 MPa – at 50 cycles) and elastic modulus (4.7 GPa – at 100 cycles, 5.4 GPa – at 50 cycles). The data obtained indicate that conductive silver-containing nanowires can be reinforcing structures for conductive metal-polymer composites with high electrical conductivity values, promising for use in flexible electronics elements.
- Keywords
- Date of publication
- 26.07.2025
- Number of purchasers
- 0
- Views
- 45
References
- 1. Goki E., Fanchini G., Manish C. // Nature Nanotechnol. 2008. V. 3. P. 270. https://doi.org/10.1038/nnano.2008.83
- 2. Ye S., Rathmell A.R., Chen Z. et al. // Adv. Mater. 2014. V. 26. P. 6670. https://doi.org/10.1002/adma.201402710
- 3. Langley D., Giusti G., Mayousse C. et al. // Nanotechnology. 2013. V. 24. P. 452001. https://doi.org/10.1088/0957-4484/24/45/452001
- 4. Hecht D.S., Hu L., Irvin G. // Adv Mater. 2011. V. 23. P. 1482. https://doi.org/10.1002/adma.201003188
- 5. McCoul D., Hu W., Gao M. et al. // Adv. Electron. Mater. 2016. V. 2. P. 1500407. https://doi.org/10.1002/aelm.201500407
- 6. Kumar A., Zhou P. // ACS Nano. 2010. V. 4. P. 11. https://doi.org/10.1021/nn901903b
- 7. Mayousse C., Celle C., Moreau E. et al. // Nanotechnology. 2013. V. 24. P. 215501. https://doi.org/10.1088/0957-4484/24/21/215501
- 8. Kwon J., Suh Y.D., Lee J. et al. // J. Mater. Chem. 2018. V. 6. P. 7445. https://doi.org/10.1039/c8tc01024b
- 9. Celle C., Mayousse C., Moreau E. et al. // Nano Res. 2012. V. 5. P. 427. https://doi.org/10.1007/s12274-012-0225-2
- 10. Jiu J., Suganuma K. // IEEE Trans. Components, Packaging Manufactur. Technol. 2016. V. 6. P. 1733. https://doi.org/10.1109/tcpmV.2016.2581829
- 11. Lan W., Chen Y., Yang Z. et al. // ACS Appl. Mater. Interfaces. 2017. V. 9. № 7. P. 6644. https://doi.org/10.1021/acsami.6b16853
- 12. Kaikanov M., Amanzhulov B., Demeuova G. et al. // Nanomaterials (Basel). 2020. V. 10. P. 2153. https://doi.org/10.3390/nano10112153
- 13. Kim Y.J., Kim G., Kim H.-K. // Metals. 2019. V. 9. P. 1073. https://doi.org/10.3390/met9101073
- 14. Seo V.H., Lee S., Min K.H. et al. // Sci. Rep. 2016. V. 6. P. 29464. https://doi.org/10.1038/srep29464
- 15. Pham S.H., Ferri A., Da A. et al. // Adv. Mater. Interfaces. 2022. V. 9. P. 2200019. https://doi.org/10.1002/admi.202200019
- 16. Xu H., Shang H., Wang C., Du Y. // Adv. Funct. Mater. 2020. V. 30. P. 2000793. https://doi.org/10.1002/adfm.202000793
- 17. Maisch P., Tam K., Lucera L. et al. // Org. Electron. 2016. V. 38. P. 139. https://doi.org/10.1016/j.orgel.2016.08.006
- 18. Zhang L., Song V., Shi L. et al. // J. Nanostruct. Chem. 2021. V. 11. P. 323. https://doi.org/10.1007/s40097-021-00436-3
- 19. Lee J., Lee P., Lee H. et al. // Nanoscale. 2012. V. 4. P. 6408. https://doi.org/10.1039/c2nr31254a
- 20. Lee P., Lee J., Lee H. et al. // Adv. Mater. 2012. V. 24. P. 3326. https://doi.org/10.1002/adma.201200359
- 21. Mitrofanov A.V., Apel P.Y., Blonskaya I.V. et al. // Tech. Phys. 2006. V. 51. P. 1229. https://doi.org/10.1134/S1063784206090209
- 22. Doludenko I.M., Volchkov I.S., Turenko B.A. et al. // Mater. Chem. Phys. 2022. V. 287. P. 126285. https://doi.org/10.1016/j.matchemphys.2022.126285
- 23. Буркат Г.К. Электроосаждение драгоценных металлов. СПб.: Политехника, 2009. 21 с.
- 24. Natter H., Hempelmann R. // J. Phys. Chem. 1996. V. 100. P. 19525. https://doi.org/10.1021/jp9617837
- 25. Глинка Н.Л. Общая химия. М.: Интеграл-пресс, 2003. 727 c.
- 26. Smits F.M. // Bell Syst. Tech. J. 1958. V. 37. P. 711.
- 27. Акименко С.Н., Мамонова Т.И., Орелович О.Л. и др. // ВИНИТИ. Сер. Критические технологии. Мембраны. 2002. Т. 15. С. 21.
- 28. Doludenko I.M. // Inorg. Mater.: Appl. Res. 2022. V. 13. P. 531. https://doi.org/10.1134/S2075113322020125
- 29. Wakamoto K., Mochizuki Y., Otsuka V. et al. // Materials. 2020. V. 13. P. 4061. https://doi.org/10.3390/ma13184061